Tape under frame for lead frame IC package assembly

Details Tape under frame for lead frame IC package assembly Tape under frame for lead frame IC package assembly

2005-07-26

2005-07-26

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S676000, C257S692000, C361S772000, C361S813000

Reexamination Certificate

active

06921966

ABSTRACT:
A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.

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