Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2004-07-28
2008-03-04
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257SE23065, C257S666000, C257S676000, C257S678000, C257S668000, C257S669000, C438S613000, C438S183000, C438S123000, C029S827000, C174S050510
Reexamination Certificate
active
07339262
ABSTRACT:
A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply voltage. The tape circuit substrate may include an insulation film and a wiring pattern formed on the insulation film to define an electronic device-mounting region and including a ground electrode. The tape circuit substrate may include a ground electrode pattern formed at the electronic device-mounting region so as to be insulated from the wiring pattern, except where the ground electrode pattern is connected to the ground electrode.
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Korean Office Action dated Aug. 25, 2005.
Kang Sa-Yoon
Lee Kwan-Jai
Son Dae-Woo
Chu Chris C.
Harness Dickey & Pierce PLC
Parker Kenneth
Samsung Electronics Co,. Ltd
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