Tape carrier type semiconductor device, method for...

Details Tape carrier type semiconductor device, method for... Tape carrier type semiconductor device, method for...

2005-03-15

2005-03-15

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S669000

Reexamination Certificate

active

06867482

ABSTRACT:
A tape carrier type semiconductor device includes a flexible substrate, on which a driver circuit is mounted and on whose surface wiring is formed. Formed in the flexible substrate are the first slit for releasing external stress and the second slit for folding the tape carrier type semiconductor device. A connector for connecting both sides of the first slit is prepared at the center of the slit, whereby the unnecessary warp of the tape carrier type semiconductor device can be reduced.

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Korean Office Action dated Aug. 26, 2002 with partial translation.
Japanese Office Action dated Jan. 13, 2004, with partial English translation.
Japanese Office Action dated Dec. 3, 2002 with partial English translation.

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