Tape-fixed leadframe

Details Tape-fixed leadframe Tape-fixed leadframe

1998-04-08

1999-10-19

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257666, 257668, 257669, 257674, 257700, 257783, 257787, H01L 23495, H01L 2353, H01L 2348, H01L 2328

Patent

active

059694122

ABSTRACT:
A tape-fixed leadframe is provided, which prevents ion migration of metal contained in leads with a simple configuration. The leadframe is comprised of electrically-conductive lead fingers and an electrically-insulating tape for fixing the lead fingers. The tape includes an electrically-insulating base film and an electrically-insulating adhesive layer formed on a surface of the base film. The adhesive layer of the tape is adhered to the lead fingers, thereby fixing the lead fingers at their original positions. The adhesive layer has protruded parts located at respective sides of each of the lead fingers, intervening parts between two adjoining ones of the protruded parts, and depressed parts opposite to the lead fingers. The protruded parts are thicker than the intervening parts. The depressed parts are thinner than the intervening parts. Ionized atoms of a metal contained in the lead fingers are trapped by the protruded parts and as a result, ion migration of the metal is prevented from occurring with a simple configuration.

REFERENCES:
patent: 5176366 (1993-01-01), Masumoto et al.
patent: 5847458 (1998-12-01), Nakamura et al.

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