Tape mounted semiconductor apparatus

Details Tape mounted semiconductor apparatus Tape mounted semiconductor apparatus

1995-05-31

1998-06-09

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257 59, 257 72, 257666, 257787, H01L 23495, H01L 2904, H01L 2328

Patent

active

057639400

ABSTRACT:
The size reduction on a longer side of a semiconductor apparatus mounted on a TAB mounting package is accomplished by slits 105' that are in contact with left and right edge portions of a potting resin 102 and that are longer than sides in the vertical direction of a base film 104. In addition, the size reduction in the vertical direction is accomplished by a structure of which an edge portion in an output outer lead portion 107 extends to the inside of a mounting region 402 of an IC chip 303 (namely, a portion below the IC chip 303) and this portion is connected to the outside of the semiconductor apparatus.

REFERENCES:
patent: 3984739 (1976-10-01), Mochizuki et al.
IBM TDB, vol. 37 No. 12 Dec. 1994, "Alignment method between tape carrier packaged driver IC and liquid crystal display glass panel", pp. 41-42.
IBM TDB, vol. 38 No. 06 Jun. 1995, "Slim and fine liquid crystal display driver packaging", pp. 461-462.

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