TCP TAB design with radial outer leads

Details TCP TAB design with radial outer leads TCP TAB design with radial outer leads

1996-04-18

1997-07-08

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, H01L 23495

Patent

active

056464410

ABSTRACT:
An integrated circuit package which has a plurality of inner surface pads located on a substrate and arranged in an angular pattern about an integrated circuit. The inner surface pads of the package are coupled to the outer surface pads of the integrated circuit with a TAB tape. The TAB tape has a plurality of conductors which each have a first end attached to the outer pads of the integrated circuit and a land portion attached to the inner surface pads of the substrate. The land portions of the tape are also arranged in an angular pattern about the integrated circuit.

REFERENCES:
patent: 5371406 (1994-12-01), Kojima et al.
patent: 5440452 (1995-08-01), Kitahara

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