Tape circuit substrate and semiconductor chip package using...

Details Tape circuit substrate and semiconductor chip package using... Tape circuit substrate and semiconductor chip package using...

2006-08-08

2006-08-08

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S700000, C257S712000, C438S113000

Reexamination Certificate

active

07087987

ABSTRACT:
A tape circuit substrate and semiconductor chip package using the same. The tape circuit substrate may comprise a base film which may be made of an insulating material and may be formed with via-holes at portions thereof, a first wiring pattern layer which may be formed on a first surface of the base film, and at least one second wiring pattern layer which may be formed on a second surface of the base film and electrically connected to a terminal which may be formed on the first surface through conductive materials, or plugs, filled in the via-holes. The semiconductor chip package may comprise a semiconductor chip which may be electrically bonded to the tape circuit substrate through chip bumps.

REFERENCES:
patent: 5639989 (1997-06-01), Higgins, III
patent: 6150193 (2000-11-01), Glenn
patent: 6414382 (2002-07-01), Hashimoto
patent: 2002/0000654 (2002-01-01), Matsuda
patent: 2003/0168969 (2003-09-01), Tanabe
patent: 2251159 (1990-10-01), None
patent: 10-0225924 (1999-07-01), None
patent: 2002-0065705 (2002-08-01), None
Notice of Examination Report, dated Jul. 8, 2005.

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