Technique for attaching die to leads

Details Technique for attaching die to leads Technique for attaching die to leads

2005-04-19

2005-04-19

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S700000, C257S786000

Reexamination Certificate

active

06882032

ABSTRACT:
A semiconductor assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminate over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their respective bond pads by a strip of anisotropically conductive elastomeric material, preferably a multi-layer laminate consisting of alternating conductive foil and an insulating elastomer wherein the laminate layers are oriented perpendicular to both the bond pad and the lead, positioned between the leads and the bond pads. A burn-in die according to the present invention is also disclosed.

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Lambert, W.R., et al., “Use Anisotropically Conductive Elastomers in High Density Separable Connectors,” Electronic Components Conference, 1989 Proceedings 39th, pp. 99-106 (May 24, 1989).

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