LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Terminal land frame and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermal ball lead integrated package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermal enhanced package for block mold assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermal enhanced upper and dual heat sink exposed molded...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermal enhanced upper and dual heat sink exposed molded...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Thermal-stress-resistant semiconductor sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thermally conductive resin sheet and power module using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thermally conductive substrate, thermally conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Thermally efficient integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Thermally enhanced chip scale lead on chip semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Thermally enhanced component interposer: finger and net...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermally enhanced component substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Thermally enhanced lead-under-paddle I.C. leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Thermally enhanced single inline package (SIP)

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thermally enhanced thin quad flatpack package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Thermally-enhanced lead frame with reduced thermal gap