Thermally enhanced component interposer: finger and net...

Details Thermally enhanced component interposer: finger and net... Thermally enhanced component interposer: finger and net...

2007-03-13

2007-03-13

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S691000, C438S123000

Reexamination Certificate

active

10815583

ABSTRACT:
An IC package dissipates thermal energy using thermally and electrically conductive thermal fingers. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal fingers encompass the die pad area to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

REFERENCES:
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5594234 (1997-01-01), Carter et al.
patent: 6483187 (2002-11-01), Chao et al.
patent: 6525942 (2003-02-01), Huang et al.

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