Thermally enhanced component interposer: finger and net...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S691000, C438S123000

Reexamination Certificate

active

10815583

ABSTRACT:
An IC package dissipates thermal energy using thermally and electrically conductive thermal fingers. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal fingers encompass the die pad area to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

REFERENCES:
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5594234 (1997-01-01), Carter et al.
patent: 6483187 (2002-11-01), Chao et al.
patent: 6525942 (2003-02-01), Huang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally enhanced component interposer: finger and net... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally enhanced component interposer: finger and net..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally enhanced component interposer: finger and net... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3726587

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.