Thermally enhanced lead-under-paddle I.C. leadframe

Details Thermally enhanced lead-under-paddle I.C. leadframe Thermally enhanced lead-under-paddle I.C. leadframe

1998-05-26

1999-07-27

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257675, 257692, 257693, 257696, H01L 23495, H01L 2348, H01L 2352

Patent

active

059295147

ABSTRACT:
A "lead-under-paddle" (LUP) leadframe employs a thermally conductive paddle/heat sink, the top side of which is adhered to an I.C. die with a thermally conductive adhesive. The inner portions of an I.C. package's leads extend along and are attached to the bottom side of the paddle with a thermally conductive and electrically isolating adhesive. Heat generated by the die is conducted to the leads and out of the package via the paddle/heat sink. The leads are in close contact with the paddle and die, reducing the leadframe's thermal resistance, increasing the amount of power that can be consumed by the die, and enabling a standard I.C. package to accommodate a paddle and die having larger respective surface areas.

REFERENCES:
patent: 5334872 (1994-08-01), Ueda et al.
patent: 5386141 (1995-01-01), Liang et al.
patent: 5436500 (1995-07-01), Park et al.
patent: 5459641 (1995-10-01), Kuriyama
patent: 5650918 (1997-07-01), Suzuki
patent: 5703398 (1997-12-01), Sono et al.
patent: 5708567 (1998-01-01), Shim et al.
patent: 5783860 (1998-07-01), Jeng et al.
patent: 5796159 (1998-08-01), Kierse
patent: 5861668 (1999-01-01), Cha

Affiliated with

Also associated with

Rating

Thermally enhanced lead-under-paddle I.C. leadframe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally enhanced lead-under-paddle I.C. leadframe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally enhanced lead-under-paddle I.C. leadframe will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-881971