Thermally enhanced component substrate

Details Thermally enhanced component substrate Thermally enhanced component substrate

2006-09-19

2006-09-19

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S692000, C257S698000, C257S706000, C257S712000, C257S676000, C257S695000, C257S707000

Reexamination Certificate

active

07109573

ABSTRACT:
An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.

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patent: 6525942 (2003-02-01), Huang et al.
patent: 2002/0001178 (2002-01-01), Iijima et al.
patent: 405330 (1991-01-01), None

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