Thermal enhanced upper and dual heat sink exposed molded...

Details Thermal enhanced upper and dual heat sink exposed molded... Thermal enhanced upper and dual heat sink exposed molded...

2005-12-09

2008-12-23

Ho, Tu-Tu V (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S706000, C257S707000, C257SE23051, C257SE23102

Reexamination Certificate

active

07468548

ABSTRACT:
A semiconductor package includes a semiconductor device30and a molded upper heat sink10. The heat sink has an interior surface16that faces the semiconductor device and an exterior surface15that is at least partially exposed to the ambient environment of the packaged device. An annular planar base11surrounds a raised or protruding central region12. That region is supported above the plane of the base11by four sloped walls13.1-13.4. The walls slope at an acute angle with respect to the planar annular base and incline toward the center of the upper heat sink10. Around the outer perimeter of the annular base11are four support arms18.1-18.4. The support arms are disposed at an obtuse angle with respect to the interior surface16of the planar annular base11.

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http://www.thefreedictionary.com/molded.
International Searching Authority, International Search Report and Written Opinion in PCT No. PCT/US2006/0061745, Mailed Apr. 17, 2008.

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