Thermally conductive resin sheet and power module using the...

Details Thermally conductive resin sheet and power module using the... Thermally conductive resin sheet and power module using the...

2006-04-21

2009-10-13

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C428S209000

Reexamination Certificate

active

07602051

ABSTRACT:
A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler. The ratio of the volume content, VL, of the flat inorganic filler to volume content, VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20, in terms of VL/VR.

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patent: 2002-167560 (2002-06-01), None
patent: 2003-133514 (2003-05-01), None
patent: 2003-238657 (2003-08-01), None

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