TFCC (TM) and SWCC (TM) thermal flex contact carriers

Details TFCC (TM) and SWCC (TM) thermal flex contact carriers TFCC (TM) and SWCC (TM) thermal flex contact carriers

2011-05-17

2011-05-17

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S692000, C257S696000, C257SE21507

Reexamination Certificate

active

07944028

ABSTRACT:
Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

REFERENCES:
patent: 3930115 (1975-12-01), Uden et al.
patent: 4647126 (1987-03-01), Sobota, Jr.
patent: 4736520 (1988-04-01), Morris
patent: 4827611 (1989-05-01), Pai et al.
patent: 5367124 (1994-11-01), Hoffman et al.

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