Thermal ball lead integrated package

Details Thermal ball lead integrated package Thermal ball lead integrated package

1995-06-28

1998-01-06

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257707, 257784, 257796, H01L 23495, H01L 2310, H01L 2334, H01L 2348

Patent

active

057058512

ABSTRACT:
A Thermal Ball Lead Integrated Package (Thermal BLIP) having improved thermal performance over prior art BLIPs is described. The BLIP combines ball and lead technologies to increase the interconnect density of the package but has relatively poor heat extraction capabilities. The Thermal BLIP is particularly well suited for high power and pin count integrated circuit devices. In an embodiment of the present invention, a heat sink is attached to the top surface of the die and extends through the package molding such that it is exposed to the ambient environment. Since the heat sink is integrated into the molding, the package size and footprint is not increased thereby limiting the cost increase of the package. This arrangement enables the use of high power devices in dense circuit board applications.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5216283 (1993-06-01), Lin
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5442230 (1995-08-01), Chillara et al.
patent: 5468999 (1995-11-01), Lin et al.

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