LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leads between chips assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leads of a no-lead type package of a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Leads under chip IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Leads under chip IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Leads under chip IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leads under chip in conventional IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leads under chip in conventional IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

LED illumination system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

LED manufacturing frame and method of using the same for manufac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

LED package and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

LED package assembly with datum reference feature

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

LED-packaging arrangement and light bar employing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Leveled non-coplanar semiconductor die contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Light emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Light-emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

LOC (lead on chip) package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

LOC semiconductor assembled with room temperature adhesive