Leads under chip IC package

Details Leads under chip IC package Leads under chip IC package

2006-08-01

2006-08-01

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S676000, C257S692000, C257S773000, C257S784000, C361S723000, C361S773000, C361S813000, C438S123000

Reexamination Certificate

active

07084490

ABSTRACT:
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane and another portion of the plurality of lead fingers of the lead frame located substantially in the same horizontal plane as the active surface of the semiconductor device. Both pluralities of lead fingers of the lead frame having their ends being located substantially adjacent the peripheral sides of the semiconductor device, rather than at the ends thereof.

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