LOC semiconductor assembled with room temperature adhesive

Details LOC semiconductor assembled with room temperature adhesive LOC semiconductor assembled with room temperature adhesive

1998-10-22

1999-09-28

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257310, 257643, 257783, H01L 23495, H01L 27108, H01L 2358

Patent

active

059593474

ABSTRACT:
A semiconductor device assembly has a lead frame and a semiconductor device configured to be attached to each other. An adhesive is applied at room temperature through a stencil to the lead frame. The semiconductor device is urged against the adhesive to effect the attachment between the semiconductor device and the lead frame. The adhesive preferably is from about 75 percent to about 95 percent isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium oxide.

REFERENCES:
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304582 (1994-04-01), Ogawa
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5446080 (1995-08-01), Shima et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5755867 (1998-05-01), Chikuni et al.

Affiliated with

Also associated with

Rating

LOC semiconductor assembled with room temperature adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with LOC semiconductor assembled with room temperature adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LOC semiconductor assembled with room temperature adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-706597