LED package assembly with datum reference feature

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Reexamination Certificate

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Details

C257S098000, C257S099000, C257S100000, C257S625000, C257S676000, C257S706000, C257S718000, C257S720000

Reexamination Certificate

active

07321161

ABSTRACT:
An LED package includes a datum reference feature that is external to the insulating body of the LED package and has a known, fixed relationship to the heat sink. The LED die is mounted to the heat sink such that the LED die has a fixed relationship to the heat sink. Accordingly, the reference datum feature provides a frame of reference to the position of the LED die within the LED package. The reference datum feature may be mounted to the heat sink or integrally formed from the heat sink. A pick-and-place head holds the LED package by engaging the datum reference feature, e.g., with an alignment pin. In addition, the LED package may include a lead that extends laterally into the insulating body, and extends towards the LED die to reduce the vertical distance between the lead and the LED die.

REFERENCES:
patent: 4884086 (1989-11-01), Kirk et al.
patent: 6023104 (2000-02-01), Koizumi et al.
patent: 6274924 (2001-08-01), Carey et al.
patent: 6541800 (2003-04-01), Barnett et al.
patent: 2002/0176250 (2002-11-01), Bohler et al.
patent: 2003/0076034 (2003-04-01), Marshall et al.
patent: 2003/0168720 (2003-09-01), Kamada
patent: 2004/0065894 (2004-04-01), Hashimoto et al.
patent: 2004/0189170 (2004-09-01), Aisenbrey
patent: 2004/0201025 (2004-10-01), Barnett et al.

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