Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1996-06-17
1997-10-14
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257786, 257723, H01L 23495
Patent
active
056775679
ABSTRACT:
A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein at least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple dice. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.
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Bruce Jeffrey D.
Habersetzer Daryl L.
Ma Manny Kin F.
Miller James E.
Roberts Gordon D.
Clark S. V.
Micro)n Technology, Inc.
Saadat Mahshid D.
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