Leads under chip IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257784, 257787, H01L 23495, H01L 2348, H01L 2328, H01L 2940

Patent

active

061304743

ABSTRACT:
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane and another portion of the plurality of lead fingers of the lead frame located substantially in the same horizontal plane as the active surface of the semiconductor device. Both plurality of lead finger of the lead frame having their ends being located substantially adjacent the peripheral sides of the semiconductor device, rather than at the ends thereof.

REFERENCES:
patent: 3444440 (1969-05-01), Bell et al.
patent: 3708730 (1973-01-01), Schlerz et al.
patent: 4048438 (1977-09-01), Zimmerman
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4447857 (1984-05-01), Marks et al.
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
patent: 4827328 (1989-05-01), Ozawa et al.
patent: 4934820 (1990-06-01), Takashashi et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4943843 (1990-07-01), Okinaga et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5445311 (1995-08-01), Trask et al.
patent: 5497030 (1996-03-01), Takeuchi
patent: 5497031 (1996-03-01), Kozono
patent: 5502278 (1996-03-01), Mabboux et al.
patent: 5504370 (1996-04-01), Lin et al.
patent: 5539251 (1996-07-01), Iverson et al.
patent: 5541446 (1996-07-01), Kierse
patent: 5550402 (1996-08-01), Nicklaus
patent: 5554886 (1996-09-01), Song
patent: 5557143 (1996-09-01), Seiji
patent: 5663594 (1997-09-01), Kimura
patent: 5763829 (1998-06-01), Tomita et al.
patent: 5776799 (1998-07-01), Song et al.
patent: 5907769 (1999-05-01), Corisis

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Leads under chip IC package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leads under chip IC package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leads under chip IC package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2258969

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.