LED package and fabrication method thereof

Details LED package and fabrication method thereof LED package and fabrication method thereof

2011-04-19

2011-04-19

Le, Thao X (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S013000, C257S079000, C257S081000, C257S091000, C257S690000, C257S685000, C257S704000, C257S708000, C257S710000

Reexamination Certificate

active

07928545

ABSTRACT:
An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

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Japanese Office Action issued Jul. 13, 2010 in the corresponding Japanese Patent Application No. 2006-214874.

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