Leads of a no-lead type package of a semiconductor device

Details Leads of a no-lead type package of a semiconductor device Leads of a no-lead type package of a semiconductor device

2005-06-21

2005-06-21

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S698000, C257S787000, C257SE23061

Reexamination Certificate

active

06909166

ABSTRACT:
The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.

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