LED manufacturing frame and method of using the same for manufac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

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Details

257 81, 257670, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053213050

ABSTRACT:
An LED manufacturing frame comprises a first tie bar extending longitudinally of the frame, a second tie bar also extending longitudinally of the frame substantially in parallel to the first tie bar, and plural groups of first to fourth consecutive leads connecting between the first and second tie bars. The first and third leads have respective extensions extending transversely beyond the first tie bar to provide first side pairs of chip bonding and wire bonding ends. Similarly, the second and fourth leads have respective extensions extending transversely beyond the second tie bar to provide second side pairs of chip bonding and wire bonding ends.

REFERENCES:
patent: 4446375 (1984-05-01), Aird
patent: 4532538 (1985-07-01), Wurz
patent: 5218233 (1993-06-01), Takahashi

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