High density direct connect LOC assembly
High density direct connect LOC assembly
High density integrated circuit assembly combining leadframe lea
High density integrated circuit assembly combining leadframe lea
High density integrated circuit package assembly with a heatsink
High density lead frames and methods for plastic injection...
High density stackable and flexible substrate-based...
High performance leadframe in electronic package
High pin count and multi-layer wiring lead frame
High power dissipating tape ball grid array package
High power LED package and fabrication method thereof
High power shunt switch with high isolation and ease of...
High reliability lead frame and packaging technology...
High speed IC package configuration
High speed IC package configuration
High speed IC package configuration
High speed IC package configuration
High temperature package flip-chip bonding to ceramic
Highly efficient both-side-cooled discrete power package,...
Highly integrated electronic component with heat-conductive plat