High performance leadframe in electronic package

Details High performance leadframe in electronic package High performance leadframe in electronic package

2005-06-07

2005-06-07

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S784000, C257S786000, C257S773000, C257S787000

Reexamination Certificate

active

06903448

ABSTRACT:
Systems and techniques to provide a high performance leadframe architecture in electronic packages. An electronic package includes an extended area for wire bonding to provide improved high-current operation. The extended area can be an extended portion of a single lead in a single-layer non-leaded leadframe, where multiple wires are connected between multiple bond pads and the single lead. The extended area can be a support bar of a leadframe that is used as bond area for ground connections in a single-layer non-leaded leadframe. The extended area can be lead regions used for wire bonding voltage output and voltage input using a reduced power dissipation topology.

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