Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1993-07-06
1995-06-27
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257713, 257691, 257695, 361676, H01L 2348
Patent
active
054282462
ABSTRACT:
A highly integrated electronic component comprised of a semiconductor body cast into a plastics enclosure. A multiplicity of metallic terminals protrude from the plastic enclosure, and a heat-conducting plate is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body. Good heat removal and an increase in the mechanical stability for the terminals are achieved by the heat-conducting plate being substantially planar and bearing both against the underside of the semiconductor body and against the underside of the terminals and by the upper side of the heat-conducting plate having a thin, electrically insulating layer.
REFERENCES:
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4884124 (1989-11-01), Mori et al.
patent: 4947237 (1990-08-01), Fasaroli
patent: 5006919 (1991-04-01), Disko
patent: 5032895 (1991-07-01), Horiuchi et al.
patent: 5041902 (1991-08-01), McShane
patent: 5225710 (1993-07-01), Westerkamp
patent: 5252855 (1993-10-01), Ogawa et al.
Rudolf F. Graf, Radio Shack Dictionary of Electronics, Second Edition, p. 36, 1978.
LSI Logic Products GmbH
Mintel William
Potter Roy
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