Highly efficient both-side-cooled discrete power package,...

Details Highly efficient both-side-cooled discrete power package,... Highly efficient both-side-cooled discrete power package,...

2007-05-22

2009-11-17

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Reexamination Certificate

active

07619302

ABSTRACT:
Two DBC wafers have patterned first conductive surfaces which receive a semiconductor die in sandwich fashion. Lead frame terminally extending into the package interior and are connected to the die terminals. The outer conductive surfaces of each of the wafers are available for two-sided cooling of the semiconductor.

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patent: 2005/0167821 (2005-08-01), Mamitsu et al.
patent: 2005/0280142 (2005-12-01), Hua et al.
International Search Report dated Feb. 27, 2008 issued in PCT Application No. PCT/US07/12328.

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