High density integrated circuit assembly combining leadframe lea

Details High density integrated circuit assembly combining leadframe lea High density integrated circuit assembly combining leadframe lea

1995-03-20

1996-10-29

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257693, 257700, 257701, H01L 23495

Patent

active

055699553

ABSTRACT:
An integrated circuit assembly is disclosed herein. The assembly includes a dielectric substrate defining a predetermined array of electrically conductive traces and an array of solder balls electrically connected to the traces. An integrated circuit chip having a series of input/output pads is supported on the substrate. In one embodiment, a plurality of leadframe leads are supported by the substrate in electrical isolation from and over the conductive traces. First and second series of bonding wires electrically connect certain ones of the input/output pads on the IC chip to the leadframe leads and conductive traces. In other embodiments, one or more electrically isolated conductive layers are supported by the dielectric substrate over the traces and leadframe leads. The integrated circuit assembly, in accordance with any of these embodiments, provides a very high density electrical interconnection arrangement for the IC chip while retaining a small package footprint.

REFERENCES:
patent: 5332864 (1994-07-01), Liang et al.
patent: 5442230 (1995-08-01), Chilara et al.
Hashemi Hassan et al: "A Mixed Solder Grid Array and Peripheral Leaded MCM Package" 1 Jun. 1993, proceedings of the electronic components and technology conference, Orlando, pp. 951-956.

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