Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2005-04-19
2005-04-19
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S667000, C257S735000, C257S784000
Reexamination Certificate
active
06882033
ABSTRACT:
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die through a plurality of conductive traces. A plurality of leads extends from the lead frame over the conductive traces proximate the semiconductor die periphery and directly attaches to and makes electrical contact with the conductive traces in a LOC arrangement. Alternately, a connector may contact a portion of the conductive trace to make contact therewith.
REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 4260429 (1981-04-01), Moyer
patent: 4636578 (1987-01-01), Feinberg
patent: 4860443 (1989-08-01), Pessavento
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5057456 (1991-10-01), Dehaine
patent: 5066614 (1991-11-01), Dunaway et al.
patent: 5079835 (1992-01-01), Lam
patent: 5138115 (1992-08-01), Lam
patent: 5138431 (1992-08-01), Huang et al.
patent: 5146308 (1992-09-01), Chance et al.
patent: 5166099 (1992-11-01), Ueda et al.
patent: 5229328 (1993-07-01), Bregman et al.
patent: 5245214 (1993-09-01), Simpson
patent: 5252853 (1993-10-01), Michii
patent: 5326932 (1994-07-01), You
patent: 5367763 (1994-11-01), Lam
patent: 5375320 (1994-12-01), Kinsman et al.
patent: 5381036 (1995-01-01), Bigler et al.
patent: 5445994 (1995-08-01), Gilton
patent: 5455200 (1995-10-01), Bigler et al.
patent: 5497032 (1996-03-01), Tsuji et al.
patent: 5498767 (1996-03-01), Huddleston et al.
patent: 5587605 (1996-12-01), Ramsey et al.
patent: 5592020 (1997-01-01), Nakao et al.
patent: 5634267 (1997-06-01), Farnworth et al.
patent: 5668055 (1997-09-01), Xu et al.
patent: 5796171 (1998-08-01), Koc et al.
patent: 5817530 (1998-10-01), Ball
patent: 5817540 (1998-10-01), Wark
patent: 5846853 (1998-12-01), Otsuki et al.
patent: 5891795 (1999-04-01), Arledge et al.
patent: 5901046 (1999-05-01), Ohta et al.
patent: 5903437 (1999-05-01), Pierson et al.
patent: 5976970 (1999-11-01), Dalal et al.
patent: 6159854 (2000-12-01), Ohtsuka et al.
patent: 6335225 (2002-01-01), Doan
Micro)n Technology, Inc.
Williams Alexander Oscar
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