High speed IC package configuration

Details High speed IC package configuration High speed IC package configuration

2005-01-25

2005-01-25

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S678000

Reexamination Certificate

active

06847100

ABSTRACT:
Devices and methods are provided for reducing lead inductance in integrated circuit (IC) packages. An integrated circuit package configuration is provided for high speed applications where the inductance of the leads is reduced or minimized in high capacity semiconductor device packages. The integrated circuit package assembly comprises a substrate, semiconductor device, insulating covering or coating, if desired, a semiconductor device retainer, lead frame, and wire bond interconnections.

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