High speed IC package configuration

Details High speed IC package configuration High speed IC package configuration

1997-12-31

2000-10-17

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257786, 257676, H01L 23495

Patent

active

06133622&

ABSTRACT:
Devices and methods for reducing lead inductance in integrated circuit (IC) packages. More specifically to an integrated circuit package configuration for high speed applications where the inductance of the leads is reduced or minimized in high capacity semiconductor device packages. The integrated circuit package assembly comprises a substrate, semiconductor device, insulating covering or coating, if desire, a semiconductor device retainer, lead frame, and wire bond interconnections.

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patent: 5583370 (1996-12-01), Higgins, III et al
patent: 5766975 (1998-06-01), Templeton, Jr. et al.

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