High density integrated circuit package assembly with a heatsink

Details High density integrated circuit package assembly with a heatsink High density integrated circuit package assembly with a heatsink

1995-11-17

1998-04-14

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257675, 257706, 257724, 257738, H01L 23495, H01L 2310

Patent

active

057395810

ABSTRACT:
An integrated circuit package assembly with a first die disposed over a first substrate having traces defined therein to provide electrical access to the first die. A heatsink is disposed over the substrate and the first die. A second die and a leadframe is disposed over the heatsink. The leadframe provides electrical access to the second die.

REFERENCES:
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5237204 (1993-08-01), Val
patent: 5442230 (1995-08-01), Chillara et al.
patent: 5486720 (1996-01-01), Kierse
patent: 5523608 (1996-06-01), Kitaoka et al.
Houghten, Jon, "Capturing Design Advantages of BGAs", SMT, Mar. 1994, pp. 36-43.

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