Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-06-16
2008-10-21
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000
Reexamination Certificate
active
07439610
ABSTRACT:
A high power shunt switch comprises a leadframe including a paddle for supporting a shunt element, and a plurality of bond pads located around a periphery of the paddle, wherein at least a first subset of the bond pads are aligned in a substantially straight-line configuration. A shunt element is fixedly attached to the paddle and wire bonded to a top surface of one the bond pads. An encapsulant is disposed on the paddle, the shunt element, the plurality of bond pads, and the wire bond, thereby forming an encapsulated package structure. The package structure is positioned and attached to a transmission line such that the bottom surfaces of each of the at least first subset of bond pads are in simultaneous contact with the transmission line. The package structure and the transmission line are fixedly attached to a suitable substrate.
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M/A-COM, Inc.
Potter Roy K
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