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Die package with asymmetric leadframe connection

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Die pad for semiconductor packages and methods of making and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Die pad structure for solder bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Die paddle clamping for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Die paddle clamping method for wire bond enhancement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Die power distribution system

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Die size-increasing integrated circuit leads and thermally...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Direct attachment of semiconductor chip to organic substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Direct contact leadless package for high current devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Display driver integrated circuit and flexible wiring board...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Dissimilar adhesive die attach for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Double downset double dambar suspended leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Double-sided thermally enhanced IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Down-bonded lead-on-chip type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Downset exposed die mount pad leadframe and package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Downset lead frame for semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Downset lead frame for semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Drop resistant bumpers for fully molded memory cards

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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