Microelectronic package having a compliant layer with bumped...
Microelectronic substrate with integrated devices
Microelectronic substrates with integrated devices
Modularized die stacking system and method
Modularly expandable multi-layered semiconductor component
Mounting structure of semiconductor device and mounting...
Multi-chip package
Multilayer wiring board incorporating carbon fibers and...
Packaging substrate comprising staggered vias
Plastic packaged semiconductor device
Plastic packages for microwave frequency applications
Polytetrafluoroethylene thin film chip carrier
Power LED package
Printed circuit board for semiconductor memory device
Process for manufacturing a plurality of strip lead frame semico
Quad flat non-leaded chip package
Reduced stress LOC assembly
Resin-sealed type semiconductor device, and method of...
Routing element for use in multi-chip modules, multi-chip...
Routing element for use in semiconductor device assemblies