Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1991-10-23
1993-03-09
Picard, Leo P.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
361400, 361404, 361405, 361409, 361421, 257675, 257676, H05K 502
Patent
active
051930536
ABSTRACT:
A plastic semiconductor device has a lead frame provided with an island for received a semiconductor element. A plurality of leads project from a square outer frame and are distributed around the periphery of the island. An insulating substrate covers and is bonded to one principal surface of the island while exposing the semiconductor element. Distributing wires are formed on one principal surface of the insulating substrate to conform with the leads. A conductive substance connects the distributing wires to the leads and fills any through-holes formed in the insulating substrate. Bonding wires connect input-output terminals of the semiconductor element to the leads. A resin body encloses and embeds the bonding wires and the semiconductor element. A heat sink may be bonded to the back face of the island.
REFERENCES:
patent: 4115837 (1978-09-01), Beall et al.
patent: 4340902 (1982-07-01), Honda et al.
patent: 4483067 (1984-11-01), Parmentier
patent: 4649418 (1987-03-01), Uden
patent: 4758927 (1988-07-01), Berg
NEC Corporation
Picard Leo P.
Whang Young S.
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