Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
1999-05-28
2001-06-19
Wong, Don (Department: 2821)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S676000
Reexamination Certificate
active
06249043
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a resin-sealed type semiconductor device, for mounting in a portable communication device etc. Specifically, the present invention relates to a highly reliable resin-sealed semiconductor device that is small in size, and can suppress the occurrence of warping.
2. Description of the Related Art
Up to now, resin-sealed type semiconductor devices that have a semiconductor element with electrodes formed on a wiring substrate constituting a wiring pattern, and a resin seal between the wiring substrate and the semiconductor element, have been proposed as resin-sealed type semiconductor devices.
SUMMARY OF THE INVENTION
An object of the present invention in to provide a highly reliable resin-sealed semiconductor device that is small in size, and can suppress the occurrence of warping of a gap inside the device and the device body itself, and a method of manufacturing such a semiconductor device.
In order to achieve the above described object, a resin-sealed type semiconductor device of the present invention comprises a wiring substrate constituting a wiring pattern, a semiconductor element having electrodes for connecting to the wiring pattern formed on surfaces thereof, and a resin seal between the wiring substrate and the semiconductor element, wherein the width of the semiconductor element is greater than the width of the wiring substrate.
Further, also in order to achieve the above described object, a method of manufacturing a resin-sealed semiconductor device of the present invention comprises the steps of arranging the semiconductor element having electrodes and a width greater than the width of the wiring substrate on the wiring substrate constituting a wiring pattern so that the wiring pattern and the electrodes are connected, and forming a resin seal between the semiconductor element and the wiring substrate by supplying resin from a gap between the semiconductor element and the wiring substrate.
REFERENCES:
patent: 5227664 (1993-07-01), Toshio et al.
patent: 5834848 (1998-11-01), Iwasaki
patent: 6087716 (2000-07-01), Ikeda
patent: 8-64725 (1996-03-01), None
patent: 8-195417 (1996-07-01), None
patent: 9-82850 (1997-03-01), None
patent: 9-139404 (1997-05-01), None
Clinger James
OKI Electric Industry Co., Ltd.
Rabin & Champagne, P.C.
Wong Don
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