Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1996-01-11
1997-08-26
Graybill, David E.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
438111, 438112, 438118, 29827, H01L 2148, H01L 2152, H01L 2158, H01L 2160
Patent
active
056610866
ABSTRACT:
Method for producing semiconductor devices comprises a first step in which a plurality of metal substrates each of which is provided with a die mounting region at a central portion thereof are connected in series to produce a train of connected metal substrates by means of first connecting tabs and a pair of first side rails each of which is provided with first positioning pilot apertures are connected to the train by means of second connecting tabs to produce a metal substrate frame, a second step in which a plurality of circuit substrates each of which is provided with a lead pattern around an opening formed at the central portion thereof are connected in series by means of third connecting tabs to produce a train of connected circuit substrates and a pair of second side rails each of which is provided with second positioning pilot apertures are connected by fourth connecting tabs to produce a circuit substrate frame, a third step in which both frames are alinged with each other making use of the first and second positioning pilot apertures and are adhered with each other to produce a die mounting substrate frame, and a fourth step in which a semiconductor die is received in a cavity defined by the die mounting region and the opening of each die mounting substrate and solder balls are connected to terminal pads which form one ends of the lead pattern while pads of the semiconductor die are connected to wire bonding pads which form other ends of the lead pattern, and connecting tabs are removed so as to produce separate semiconductor devices.
REFERENCES:
patent: 4980219 (1990-12-01), Hiraide et al.
patent: 4981817 (1991-01-01), Stone, Jr.
patent: 5182851 (1993-02-01), Bond et al.
Nakashima Takashi
Takai Keiji
Tateishi Kouji
Graybill David E.
Mitsui High-Tec, Inc.
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