Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2005-04-19
2005-04-19
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S685000, C257S784000, C257S786000, C257S691000
Reexamination Certificate
active
06882034
ABSTRACT:
A routing element for use with a multichip module includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths that those provided by a multichip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.
REFERENCES:
patent: 4709468 (1987-12-01), Wilson
patent: 4890157 (1989-12-01), Wilson
patent: 5245216 (1993-09-01), Sako
patent: 5362984 (1994-11-01), Konda et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6137164 (2000-10-01), Yew et al.
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6284982 (2001-09-01), Kusner et al.
patent: 6333549 (2001-12-01), Drehobl et al.
patent: 6444921 (2002-09-01), Wang et al.
patent: 6462976 (2002-10-01), Olejniczak et al.
patent: 6492201 (2002-12-01), Haba
patent: 6521994 (2003-02-01), Huse et al.
patent: 6521995 (2003-02-01), Akram et al.
patent: 20020039464 (2002-04-01), Yoshimura et al.
patent: 20020050633 (2002-05-01), Matsumoto
patent: 20020171144 (2002-11-01), Zhang et al.
Brooks Jerry M.
Corisis David J.
Reynolds Tracy V.
Schwab Matt E.
Flynn Nathan J.
Greene Pershelle
Micro)n Technology, Inc.
TraskBritt
LandOfFree
Routing element for use in multi-chip modules, multi-chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Routing element for use in multi-chip modules, multi-chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Routing element for use in multi-chip modules, multi-chip... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3429903