2-Metal layer TAB tape and both-sided CSP•BGA tape
Adhesive film for semiconductor, lead frame and...
Anisotropic conductive film-containing device
Apparatus and method for containing semiconductor chips to...
Apparatus for flip-chip packaging providing testing capability
Apparatus for use in semiconductor wafer processing for...
BGA package and method of fabrication
Bump pattern design for flip chip semiconductor package
Carrier based IC packaging arrangement
Carrier film with peripheral slits
Carrier for film carrier type semiconductor device
Carrier for substrate film
Ceramic terminal block, hermetic sealed package, and complex sem
Chip arrangement
Chip carrier film, method of manufacturing the chip carrier...
Chip carrier having ventilation channels
Chip-mounted film package
Circuit pattern for a ball grid array integrated circuit package
Circuit tape having adhesive film, semiconductor device, and a m
COF package and tape substrate used in same