Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2007-05-29
2007-05-29
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257SE23062, C257S700000, C257S701000, C257S702000, C257S774000, C257S703000, C257S757000, C257S680000, C257SE23006, C257SE23007, C361S751000, C361S792000, C361S793000, C428S209000, C428S901000, C174S255000, C174S257000, C174S258000, C174S657000, C174S260000
Reexamination Certificate
active
11141643
ABSTRACT:
A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).
REFERENCES:
patent: 4591659 (1986-05-01), Leibowitz
patent: 5436062 (1995-07-01), Schmidt et al.
patent: 6114005 (2000-09-01), Nagai et al.
patent: 6222740 (2001-04-01), Bovensiepen et al.
patent: 6625032 (2003-09-01), Ito et al.
patent: 6846528 (2005-01-01), Osumi et al.
patent: 7038142 (2006-05-01), Abe
patent: 2003/0136577 (2003-07-01), Abe
patent: 2005/0252682 (2005-11-01), Shimoto et al.
patent: 60-140898 (1985-07-01), None
patent: 11-40902 (1999-02-01), None
patent: 11-238971 (1999-08-01), None
patent: 2000-340895 (2000-12-01), None
patent: 2001-332828 (2001-11-01), None
patent: 2002-319764 (2002-10-01), None
patent: 2003-8207 (2003-01-01), None
Abe Tomoyuki
Hayashi Nobuyuki
Tani Motoaki
Staas & Halsey , LLP
Williams Alexander Oscar
LandOfFree
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