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Stacked land grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Stacked leads-over chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Stacked leads-over chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Stacked leads-over chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Stacked leads-over-chip multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Stacked mass storage flash memory package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked mass storage flash memory package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked mass storage flash memory package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked memory and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked memory device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked micro ball grid array packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Stacked microelectronic assembly and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Stacked microelectronic assembly and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked microelectronic device assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked microelectronic dies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked microelectronic packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked module package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked multi-chip modules using C4 interconnect technology...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Stacked multi-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked multi-chip package, process for fabrication of chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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