Stacked multi-chip package

Details Stacked multi-chip package Stacked multi-chip package

2007-02-20

2007-02-20

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S675000, C257S707000

Reexamination Certificate

active

10995380

ABSTRACT:
A stacked multi-chip package comprising a substrate, a first chip, a lead frame, and a second chip is provided. The first chip is placed on and electrically connected with the substrate. The lead frame is placed on the substrate and forming a space therebeneath to accommodate the first chip. The second chip is placed to the lead frame and electrically connected with the substrate through the lead frame.

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