Stacked memory and manufacturing method thereof

Details Stacked memory and manufacturing method thereof Stacked memory and manufacturing method thereof

2006-12-05

2006-12-05

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S692000, C257S673000, C257S693000, C257S698000, C257S696000, C257S737000

Reexamination Certificate

active

07145227

ABSTRACT:
To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer substrates with the TSOPs mounted thereon are stacked in eight layers in such a manner that the TSOPs face downward. Then, leads of the upper interposer substrate are joined to pads formed in the rear face of the lower interposer substrate by a thermosetting conductive resin, so that the interposer substrates adjacent in a vertical direction are connected.

REFERENCES:
patent: 5371560 (1994-12-01), Kiehne et al.
patent: 5377077 (1994-12-01), Burns
patent: 5397916 (1995-03-01), Normington
patent: 5744827 (1998-04-01), Jeong et al.
patent: 5840417 (1998-11-01), Bolger
patent: 6238599 (2001-05-01), Gelorme et al.
patent: 6424031 (2002-07-01), Glenn
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 05-191028 (1993-07-01), None
patent: 11-111914 (1999-04-01), None
patent: 11-137516 (1999-05-01), None
patent: 2000-031617 (2000-01-01), None
patent: 2000-286380 (2000-10-01), None
patent: 2002-009227 (2002-01-01), None
patent: WO 99/65062 (1999-12-01), None
patent: WO 01/06562 (2001-01-01), None

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