Stacked mass storage flash memory package

Details Stacked mass storage flash memory package Stacked mass storage flash memory package

2008-05-20

2008-05-20

Dickey, Thomas (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S723000, C257S737000, C257SE23123, C257SE21614, C257S786000

Reexamination Certificate

active

10933059

ABSTRACT:
A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The stacked multiple offset chip device permits a plurality of dice to be stacked in a maximum density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.

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