Heat dissipation in integrated circuits

Details Heat dissipation in integrated circuits Heat dissipation in integrated circuits

2006-08-31

2009-12-15

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S713000, C257S722000, C257S723000, C257S724000, C257S796000, C257SE23051

Reexamination Certificate

active

07633152

ABSTRACT:
The present invention provides an integrated circuit and method of manufacture therefore. The integrated circuit, in one embodiment, includes heat conducting elements located proximate a plurality of heat generating components located over a substrate. The integrated circuit may further include a heat radiating element comprising one or more fins in thermal communication and physical contact with the heat conducting elements, the heat radiating element configured to dissipate heat generated by the heat generating components away from the integrated circuit.

REFERENCES:
patent: 4964458 (1990-10-01), Flint et al.
patent: 5621616 (1997-04-01), Owens et al.
patent: 6046503 (2000-04-01), Weigand et al.
patent: 6100199 (2000-08-01), Joshi et al.
patent: 6800886 (2004-10-01), Awano

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