Heat dissipation apparatus for package device

Details Heat dissipation apparatus for package device Heat dissipation apparatus for package device

2007-08-21

2007-08-21

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S704000, C257S706000, C257S713000, C257S778000, C257SE23181

Reexamination Certificate

active

10919276

ABSTRACT:
Heat dissipation apparatus applies to a package device on a substrate. The package device has an upper surface, a bottom surface, and a sidewall between the upper and bottom surfaces, in which the bottom surface thermally contacts the substrate through multitudes of conductive bumps. For dissipating heat from the bottom surface, the heat dissipation apparatus includes a first heat-dissipating structure contacting a portion of the bottom surface and a second heat-dissipating structure on the upper surface. With the surrounding association of the first and the second heat-dissipating structures, these structures release heats from the sidewall of the die. Such a heat dissipation apparatus is capable of discharging heat at three dimensions, preventing the conductive bumps from collapsing, and enhancing reliability.

REFERENCES:
patent: 5739585 (1998-04-01), Akram et al.
patent: 5866943 (1999-02-01), Mertol
patent: 6133064 (2000-10-01), Nagarajan et al.
patent: 6219254 (2001-04-01), Akerling et al.
patent: 6515870 (2003-02-01), Skinner et al.
patent: 2001/0033017 (2001-10-01), Wang et al.
patent: 2003/0067746 (2003-04-01), Ishimine

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