Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1999-06-28
2000-01-25
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257718, 257707, H01L 2334
Patent
active
060181931
ABSTRACT:
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.
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Gilson Charlie W.
Irmscher Horst F.
Jondrow Tim J.
Rubens Paul A.
Spreadbury Brian G.
Clark Sheila V.
Hewlett--Packard Company
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